SnCl₄ and EDTA-4Na were dissolved in a 2 mol/dm³ CH₃COOH - 2 mol/dm³ CH₃COONa buffer solution, and was adjusted to pH4.1 by adding 2 mol/dm³ CH₃COOH or 2 mol/dm³ CH₃COONa solutions. 100 cm³ of the electrolyte was used. In the stationary state, Sn film was not deposited below 100 mA/cm², and Sn film deposited in the range of 200 to 1000 mA/cm². However, thickness was not obtained 1 μm. In the sonication, electrodeposited film obtained 5 ∼ 20 μm in the range of 200 to 1000 mA/cm². Electrodeposition was carried out smoothly, because the mass transfer accelerated with ultrasonic agitation and Sn ion was supplied to electrode surface. Best conditions of sono-electroplating were 0.10 mol/dm³ SnY, pH 4.0, 298 K and 300 mA/cm². The mass transfer and crystallization processes were most affected with micro-jet and shock wave pressure in the range of 200 ∼ 400 mA/cm². Exchange current density and reaction rate constant in the sonication increased compared with that in the stationary and vibration states. As for this, an electron reaction becomes fast by the micro-jet or shock wave pressure. Reduction became difficult to break out as sonication was with powerful agitation. The deposited film was smooth and dense surface in the sonication compared with that in the stationary states by the shock wave pressure. [DOI: 10.1380/ejssnt.2006.574]