IEICE Electronics Express
Online ISSN : 1349-2543
ISSN-L : 1349-2543
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CMOS on-chip stacked Marchand balun for millimeter-wave applications
Lai Chee-Hong IvanInui ChiakiFujishima Minoru
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2007 Volume 4 Issue 2 Pages 48-53

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Abstract

A millimeter-wave CMOS on-chip stacked Marchand balun is presented in this paper. The balun is fabricated using a top pad metal layer as the single-ended port and is stacked above two metal conductors at the next highest metal layer in order to achieve sufficient coupling to function as the differential ports. Strip metal shields are placed underneath the structure to reduce substrate losses. An amplitude imbalance of 0.5dB is measured with attenuations below 6.5dB at the differential output ports at 30GHz. The corresponding phase imbalance is below 5 degrees. The area occupied is 229µm × 229µm.

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© 2007 by The Institute of Electronics, Information and Communication Engineers
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