2005 Volume 113 Issue 1322 Pages 687-691
The details of a novel ceramic forming process are presented in this paper. Compared to the conventional techniques, the process cuts the amount of added organic binder by half. The process can be characterized by creating a photoreactive thin-film of chemically bonded organic binder on particles' surfaces which subsequently acts as a bridge for the linkage of the whole particle assembly upon radiation by UV-light. Such thin-film use of an organic binder and significantly stronger bonding due to the chemical forces involved are the highlights of this new approach in green body forming.