MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
High-Strength and High-Speed Bonding Technology using Thick Al-Ni Wire
Jin OnukiTakao KomiyamaYasunori ChonanMasahiro Koizumi
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2002 Volume 43 Issue 8 Pages 2157-2160

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Abstract

In order to create high-strength and high-speed thick Al wire bonding technology, high-temperature bonding at 423 K using Al–Ni wire has been investigated. It was found that Al–Ni wire bonds exhibit higher bonding strength than those of Al wire bonds. Al–Ni wire bonds joined at 423 K for 40 ms exhibited high-strength comparable to those of Al–Ni wire bonds joined at RT for 180 ms. It was found that high-temperature, high-speed bonding substantially reduces the occurrence of Si damage. High-temperature and high-speed bonding with Al–Ni wire can be considered as a promising bonding technology for the mass production of low cost power modules.

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© 2002 The Japan Institute of Metals and Materials
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