The copper films were electrodeposited from aqueous and organic solutions in the presence and in the absence of ultrasound. The internal stress and texture in copper films were studied using the X-ray diffraction (XRD). The results showed that the internal stress and texture of the copper films were reduced on the effect of ultrasound. The surface morphology of copper grains was investigated using scanning electron microscopy (SEM). The results showed that the porous structure was formed on the surface of copper grains deposited in organic solution under ultrasonic radiation.