Journal of Photopolymer Science and Technology
Online ISSN : 1349-6336
Print ISSN : 0914-9244
ISSN-L : 0914-9244
Evaluation of Next Generation Fluids for ArF Immersion Lithography Beyond Water
Hoang Tran, Roger H. French, Douglas J. Adelman, Jerald Feldman, Weiming Qiu, Robert C. Wheland, Luke W. Brubaker, Brian E. Fischel, Barbara B. Fones, Michael F. Lemon, Min K. Yang, Osami Nagao, Mureo Kaku, Michael Mocella, John J. Schmieg
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Keywords: immersion lithography, second generation fluid, third generation fluid, hydrocarbons, refractive index, absorbance, fluid handling, radiation durability, active recycle, window contamination, particle contamination, leaching, resist/fluid interactions, defectivity
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2007 Volume 20 Issue 5 Pages 729-738

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Abstract

Optical immersion lithography using fluids with refractive indices greater than that of water (1.44) can enable numerical apertures of 1.55 or above for printing sub-45 nm lines. We continue to work on delivering second generation high index immersion fluid technology to extend immersion lithography. Several fluids have been optimized to meet the required specifications of refractive index (n ≥ 1.64) and absorbance (< 0.10 / cm) at 193 nm. Here, we report on recent processing studies on two of our leading fluid candidates, designated IF132 and IF169. We are developing methods to ensure reproducible, low-absorbance fluid with low particle counts. We have also studied fluid changes on exposure to 193nm laser irradiation, and have quantified both photobleaching and photodarkening processes as a function of a number of fluid and process parameters. Through the development of a Standard Stepper Tool model, we are able to correlate our test system results to those expected in a commercial exposure system. Finally, studies of fluid-resist interactions - including PAG leaching measurements, resist thickness changes, and resist surface residues and defects - are providing valuable information on fluid compatibility with 193nm photoresists, and the effects of fluid purity on such interactions.

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© 2007 The Society of Photopolymer Science and Technology (SPST)
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