表面科学
Online ISSN : 1881-4743
Print ISSN : 0388-5321
ISSN-L : 0388-5321
III-V化合物半導体表面へのメタライゼイション
小川 正毅
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ジャーナル フリー

1981 年 2 巻 4 号 p. 265-271

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Alloying reactions of metal films deposited on chemically etched GaAs and InP surfaces, (Ni/Au-Ge and Ni films for GaAs, Au and Au-Zn films for InP), were studied using micro-probe Auger electron spectroscopy, X-ray photoelectron spectroscopy, reflection and transmission electron diffraction, and X-ray diffraction. The chemically etched surfaces are covered with thin native oxide layers (5-10 Å thick). Metallization without interfacial native oxide layers is realized by depositing metals, (Ni for GaAs and Au for InP), which have a capability to produce compounds with both III and V group elements.

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