2005 年 25 巻 Supplement2 号 p. 329-330
Experimental study on enhanced forced cooling of electronics device using heat transfer from a printed circuit board has been conducted. Flow field in the electronics casing model was visualized and measured using a PIV. The existence of the stagnation regions upstream and downstream of the heater element on the printed circuit board was confirmed. It is shown that flow condition and velocity profiles over the heater changes depending on the flow rate.