The internal stress in electrodeposited copper from cyanide baths is one of the very important factors since the copper is widely used as an undercoat for nickel and other platings. This paper reports the stress measured by Right Flat Strip method under various electrolytic conditions as well as various bath compositions and additives.
The results obtained were summarized as follows.
(1) There were little effects of bath compositions and other electrolytic conditions on internal stress.
(2) The addition of inorganic compounds (particularly the compounds, which seem to be deposited together with copper) increased the tensile stress with the increase in its amount of addition or increase in current density. However, the addition of a very small ammunt of lead compounds decreased the tensile stress.
(3) The addition of sulfur compounds containing free sulfur increased tensile stress with the increase in their amount of addition or increase in PR current density.
(4) The addition of most of organic compounds had no remarkable effects on the internal stress.